WDS-580 Non-optical Repair Chip Dismantling and Soldering Table, Three Constant Temperature Repair Table & Laptop or any Equipment
Manual BGA Rework Station
Model: WDS-580
1. Repair Success Rate: More Than 99%.
2. Using The Industrial Touch Screen.
3. Independent 3 Heating Zones, Hot Air Heating / Infrared. Preheat. (temperature accuracy ± 3℃).
4. With CE Certification.
Specification Of WDS-580 Hot Air BGA Rework Station
| Total Power | 4800W |
| Upper Heating Power | 800W |
| Lower Heating Power | 1200W |
| Infrared Heating Power | 2700W(1200WÂ is controlled) |
| Power supply |  (Single Phase)  AC 220V±10  50Hz |
| Location way | Â V-shape card slot +Â Universal jigs |
| Temperature Controlling | K-type thermocouple closed loop control, independent temperature control, precision up to ±3 degree |
| Electrical  Material |  Touch screen + Temperature control module + PLC control |
| Max PCB size | 400×370mm |
| Min PCB size | 10×10mm |
| Sensor | Â 1 unit |
| PCB Thickness | 0.3-5mm |
| Suitable Chip Size | 2*2mm-60*60mm |
| Machine Size | 500×590×650mm |
| Weight | Â Net 50kg |
Our BGA Rework Station/ BGA reballing station: to replace and repair the BGA chip in a laptop or mobile phone.
The main user: repairing shops and factories to provide the after-sales service and rework.
| Weight | 100 kg |
|---|
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