Product usage

1. S-BGN2 is used to fix the motherboard and provide a heating function for the motherboard
2. It can be used to replace large and small CPUs, graphics cards, PCHs, memory/SSDs, and remove the T2 chip.
3. Supports BGA chip disassembly and assembly of MacBook, iPad logic board, Windows notebooks, tablets, etc.
4. Auxiliary heating/Removal of high-temperature solder, Replacement of BGA processors, Fixing motherboard/Convenient removal of black glue from BGA chip

Platform Working Modes

1. Baking Board

• Baking motherboard
• Auxiliary heating for cleaning high-temperature solder from pads
• Remove RAM/T2 chips
• General high-temperature applications

2. CPU/PCH

• Welding large processors (e.g., Intel CPUs, M1 Pro/Max, M2 Pro/Max)
• Welding GPUs (graphics card chips).

3. Small CPU/PCH

• Welding small processors (e.g., A1932/A2179, M1/M2/M3)
• Welding Platform Controller Hubs (PCH)

4. Pause/Return

• Pause: Stops or starts the current process
• Return: Long press to return to the home page

Interface Functions:

• ON/OFF: Switch key (Controls the main power input on and off)
• AC~INPUT (110V-220V): AC power input, supports 110V and 220V specifications
• 30:00: 30-minute power protection. The power is automatically cut off after 30 minutes of working. Heats for a long time
• RESET: The button resets the host’s status. After pressing the “RESET” button, the host will return to the working state.