DH-G620 Best BGA Rework Station with Optical Alignment System
DH-G620 Laptop Repair Tool Automatic Bga Rework Station with CCD Optical Alignment System
Product Description
Product Application
Semi-auto BGA rework station DH-G200 CCD optical alignment system, repairing CPU, vpu and BGA chips of electronic products, chip positioning precisely at: ±0.01 mm, temperature accuracy: ±1℃.
DH-G620 SPECIFICATION | |
Power(Max) | 5500W best soldering rework station |
Top heater | 1200W best smd soldering station |
Bottom heater | 2nd 1200W, 3rd IR heater 3000W |
Power supply | 220V 50/60Hz |
Top hot air flow speed | be able to adjust by knob |
Operation mode | Manual operation. HD touch screen, intelligent man-machine, digital system setting |
Optical CCD camera lens | frontward & backward |
BGA chip positioning | Optical CCD alignment system + laser, fast and accurate. |
Camera magnification | 10x ~ 200x |
Workbench fine-tuning | ±15mm forward & backward, ±15mm right/left |
placement accuracy | ±0.01mm |
Lighting | Taiwan LED working light, any angle adjusted |
Temperature profile | 5,000 groups |
PCB Positioning | Intelligent positioning, PCB board can be adjusted in X, Y direction with “5 points support”, V-groove PCB bracket + universal fixtures |
Temperature control | K sensor closed loop best SMD machine |
Temperature accuracy | ±2℃ |
PCB size | Min 22*22mm , Max 370*410mm |
BGA chip | Min 2*2mm, Max 80*80mm |
Minimum chip spacing | 0.15mm |
External temp sensor | 1 pcs |
Dimension | L610*W570*H750 mm |
Net weight | 100kg |
Lead time
| Quantity (sets) | 1 – 10 | > 10 |
| Lead time (days) | 5 | To be negotiated |
Main Features
1) Embedded with Industrial PC + Intelligent temperature module, Stable and reliable.
2) HD touchscreen in English and Chinese + USB interface, easy to operate.
3) With 5 different sizes of nozzles: upper: 31*31 mm, 38*38 mm,41*41 mm. Bottom: 34*34 mm, 55*55 mm.
4) Any size of nozzle can be customized, Titanium alloy material, never deformed, never rusty.
5) Adopt three heating zones; the upper heater and lower heater are hot air, bottom is an infrared preheating zone.
6) High-power cross-flow fan, making the PCB board cool fast, preventing it from being deformed.
Accurate temperature control:
1)Three independent heaters + PID self-setting adjusted + independently controlling to ensure temperature accuracy.
2)It can set 8-segment heating, and massive storage of group temperature profiles.
3)Setting BGA heating curve conveniently.
4)Automatic temperature curve generating and real-time showing.
Convenient visual alignment:
1)Optical alignment system + CCD color lens system.
2)2 color separation, magnification, micro adjustment.
3)Auto focus, auto correction, auto color differentiation.
4)Light position can be flexible.
5) Japanese camera that can move forward and backward.
6)Built-in vacuum sucker, pick up the BGA chip conveniently after desoldering.
Precision components:
1)Precise fine-tuning knob of BGA chip, adjust the angle of the BGA chip to align.
2)X, Y, R micrometers fine-tuning; placement accuracy will be ±0.01 mm.
3)V-groove clamp + universal fixture suitable for all kinds of PCB.
4)Hot air nozzle with magnet, rotate at any angle, easy to replace and operate.
5)Heating system and placement head 2-in-1 design, precise positioning.
6)Top air flow speed adjusted function, prevents tiny BGA from being moved when heating.
Perfect security design:
1)With fan failure protection and thermocouple failure protection function.
2)Overheating protection, emergency stop function.
3). Vacuum sucker hitting protection. best hot air rework station 2020
Application:
Suitable for all kinds of BGA repairing (CCGA、BGA、QFN、 CSP、LGA、Micro SMD、MLF…)
Lead and Lead-free


































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