Introduction:
Rework help paste applied to mobile phone PCB, BGA, SMD’s PGA, etc.
It’s used in low ionic activator systems, tin-run speed
Low level of smoke, surface insulation resistance value is the high residue after curing
Therefore, the electrical properties of cell phones and other communications products, have very little interference
Features:
NC-559 as a leave-in help paste residue color is very light, there is a very high value of SIR
Recommended for BGA, CSP, and other solder ball array repair and fill the ball
When using smoke less, no residue. Affordable.

Suitable for:
North and south bridge, cards, cell phone chip, video chip BGA solder, bumping
Also can used off the tin, the effect is very ideal
The residue was less bright spot, with less smoke, and no pungent odor, do not run the ball

Package included:1 PC